4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

James Howard Knapp

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Method of forming a semiconductor package and leadframe...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Microelectronic package including a polymer encapsulated die

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Microelectronic package including a polymer encapsulated die, an

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Profile ID: LFUS-PAI-P-1402941

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