Method of forming a semiconductor device and structure thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S287000, C438S239000, C438S240000, C438S591000, C257SE21177

Reexamination Certificate

active

07144784

ABSTRACT:
In one embodiment, a method for forming a semiconductor device is described. A semiconductor substrate has a first portion and a second portion. A first dielectric layer formed over the first portion of the semiconductor substrate and a second dielectric layer is formed over the second portion of the semiconductor substrate. A cap that may include silicon, such as polysilicon, is formed over the first dielectric layer. A first electrode layer is formed over the cap and a second electrode layer is formed over the second dielectric.

REFERENCES:
patent: 4324038 (1982-04-01), Chang et al.
patent: 6919244 (2005-07-01), Remmel et al.
patent: 2004/0026731 (2004-02-01), Clevenger et al.
patent: 2004/0032001 (2004-02-01), Gilmer et al.
S.B. Samavedam, et al., “Dual-Metal Gate CMOS with HIO2Gate Dielectric,” Digital DNA Laboratories, 3501 Ed Bluestein Blvd., Texas 78721, USA.
Related U.S. Appl. No. 10/876,820 filed Jun. 25, 2004.
Related U.S. Appl. No. 10/400,896 filed Mar. 27, 2003.
Related U.S. Appl. No. 10/209,523 filed Jul. 31, 2002.

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