Method of forming a polysilicon film and method of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21409, C257SE21413

Reexamination Certificate

active

07923316

ABSTRACT:
In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

REFERENCES:
patent: 5313076 (1994-05-01), Yamazaki et al.
patent: 5583369 (1996-12-01), Yamazaki et al.
patent: 5693545 (1997-12-01), Chung et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5705413 (1998-01-01), Harkin et al.
patent: 5946561 (1999-08-01), Yamazaki et al.
patent: 6271066 (2001-08-01), Yamazaki et al.
patent: 6376290 (2002-04-01), Gosain et al.
patent: 6562672 (2003-05-01), Yamazaki et al.
patent: 6570223 (2003-05-01), Machida et al.
patent: 6794277 (2004-09-01), Machida et al.
patent: 6964890 (2005-11-01), Yamazaki et al.
patent: 6977206 (2005-12-01), Huang et al.
patent: 7045469 (2006-05-01), Sohn et al.
patent: 7071083 (2006-07-01), Lin
patent: 2001/0010391 (2001-08-01), Nakajima et al.
patent: 2003/0008437 (2003-01-01), Inoue et al.
patent: 2003/0155572 (2003-08-01), Han et al.
patent: 2003/0173601 (2003-09-01), Machida et al.
patent: 2004/0121529 (2004-06-01), Sohn et al.
patent: 2004/0253797 (2004-12-01), Huang et al.
patent: 2005/0079294 (2005-04-01), Lin et al.
patent: 2005/0142707 (2005-06-01), Kim et al.
patent: 2006/0043367 (2006-03-01), Chang et al.
patent: 1085352 (1994-04-01), None
patent: 05-206468 (1993-08-01), None
patent: 10-2001-0020826 (2001-03-01), None
patent: 10-2001-0030364 (2001-04-01), None
Korean Office Action dated Mar. 22, 2010 for corresponding Korean Application No. 10-2003-0077763 (with English-language translation).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a polysilicon film and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a polysilicon film and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a polysilicon film and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2699825

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.