Method of forming a multichip module having chips on two sides

Details Method of forming a multichip module having chips on two sides Method of forming a multichip module having chips on two sides

2005-12-13

2005-12-13

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S841000, C174S260000, C257S778000, C361S783000

Reexamination Certificate

active

06973715

ABSTRACT:
A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at least one semiconductor device is attached to the other side of the thin film structure. There is interconnectvity through the thin film structure between the semiconductor devices and the frame.

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