4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

Joseph Michael Sullivan

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High density electrical interconnect apparatus and method

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Method of forming a multichip module having chips on two sides

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Multichip module having chips on two sides

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-456784

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