Method of forming a mold

Details Method of forming a mold Method of forming a mold

1990-11-21

1993-08-10

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

With step of making mold or mold shaping, per se

Utilizing surface to be reproduced as an impression pattern

264 60, 264 63, 264220, C04B 3564

Patent

active

052346552

ABSTRACT:
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

REFERENCES:
patent: 2939199 (1960-09-01), Strivens
patent: 3445250 (1969-05-01), Preece
patent: 4197118 (1980-04-01), Wiech
patent: 4305756 (1981-12-01), Wiech
patent: 4562092 (1985-12-01), Wiech
patent: 4994215 (1991-02-01), Wiech

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