Method of forming a moisture guard ring for integrated circuit a

Details Method of forming a moisture guard ring for integrated circuit a Method of forming a moisture guard ring for integrated circuit a

1997-10-09

1999-07-20

Fourson, George

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

438401, 438454, H01L 2176

Patent

active

059266970

ABSTRACT:
An improved and new structure and method for forming a guard ring in an integrated circuit having at least one level of polysilicon wiring has been developed. The guard ring is formed without necessitating additional manufacturing process steps and the guard ring is bonded to the semiconductor substrate, thereby providing a superior barrier to diffusion of moisture and contaminants from a window in the insulating layers to the semiconductor device regions.

REFERENCES:
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patent: 5087577 (1992-02-01), Strack
patent: 5444012 (1995-08-01), Yoshizumi et al.
patent: 5538924 (1996-07-01), Chen
patent: 5567643 (1996-10-01), Lee et al.
patent: 5750414 (1998-05-01), Whitney
patent: 5847433 (1998-12-01), Kerber

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