Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-10-19
2000-06-06
Fahmy, Wael
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438666, 438620, 438618, 438778, H01L 2144, H01L 214763, H01L 2131, H01L 21469
Patent
active
060718129
ABSTRACT:
A method of fabricating a metal contact in a reduced aspect ratio contact hole. The method begins by forming a first insulating layer and a first barrier layer having a first barrier opening over a substrate. The first insulating layer is anisotropically etched through the first barrier opening forming an upper contact hole. A second barrier layer is formed on the first barrier layer and the first insulating layer. The second barrier layer is anisotropically etched forming spacers on sidewalls of the first insulating layer. The first insulating layer is anisotropically etched using the first barrier layer and the spacers as an etch mask forming a lower contact hole. The first barrier layer and the spacers are removed to form the reduced aspect ratio contact hole. The reduced aspect ratio contact hole is comprised by the upper and lower contact holes. The reduced aspect ratio contact hole is filled with a contact metal to contact the contact region in the substrate.
REFERENCES:
patent: 5371042 (1994-12-01), Ong
patent: 5629237 (1997-05-01), Wang et al.
patent: 5686354 (1997-11-01), Avanzino et al.
patent: 5861343 (1999-01-01), Tseng
Chuang Kun-Jung
Hsu Shou-Yi
Lui Hon-Hung
Ackerman Stephen B.
Berezny Neal
Fahmy Wael
Saile George O.
Stoffel Willliam J.
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