Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-10-30
2008-11-18
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S736000, C438S737000, C438S738000, C438S743000, C438S744000, C257SE21014, C257SE21035, C257SE21038, C257SE21633, C257SE21639
Reexamination Certificate
active
07452825
ABSTRACT:
In the method of forming a mask structure, a first mask is formed on a substrate where the first mask includes a first mask pattern having a plurality of mask pattern portions having openings therebetween and a second mask pattern having a corner portion of which an inner side wall that is curved. A sacrificial layer is formed on the first mask. A hard mask layer is formed on the sacrificial layer. After the hard mask layer is partially removed until the sacrificial layer adjacent to the corner portion is exposed, a second mask is formed from the hard mask layer remaining in the space after removing the sacrificial layer. A minute pattern having a fine structure may be easily formed on the substrate.
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Cho Han-Ku
Jung Sung-Gon
Koh Cha-Won
Lee Doo-Youl
Lee Suk-Joo
Lebentritt Michael S
Myers Bigel Sibley & Sajovec P.A.
Samsung Electronics Co,. Ltd.
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