Method of forming a mask structure and method of forming a...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S736000, C438S737000, C438S738000, C438S743000, C438S744000, C257SE21014, C257SE21035, C257SE21038, C257SE21633, C257SE21639

Reexamination Certificate

active

07452825

ABSTRACT:
In the method of forming a mask structure, a first mask is formed on a substrate where the first mask includes a first mask pattern having a plurality of mask pattern portions having openings therebetween and a second mask pattern having a corner portion of which an inner side wall that is curved. A sacrificial layer is formed on the first mask. A hard mask layer is formed on the sacrificial layer. After the hard mask layer is partially removed until the sacrificial layer adjacent to the corner portion is exposed, a second mask is formed from the hard mask layer remaining in the space after removing the sacrificial layer. A minute pattern having a fine structure may be easily formed on the substrate.

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patent: 11-274158 (1999-10-01), None
patent: 2004-004904 (2004-01-01), None
patent: 2004-093705 (2004-03-01), None

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