Method of forming a critical resist pattern

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430325, 430326, 430330, 430961, G03F 738

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054299101

ABSTRACT:
A resist pattern having an accurate rectangular sectional configuration and high dimension controllability can be formed using a conventional chemical amplification positive type resist. A chemical amplification positive type resist layer 3 including a base resin, and a protonic acid generating agent decomposed by photochemical reaction to generate protonic acid and a dissolution inhibitor is formed on a semiconductor substrate 2. Light 8 is selectively directed to the chemical amplification positive type resist layer 3 to form an image. The chemical amplification positive type resist layer 3 after irradiation of light 8 has its surface treated with an acid solution 1 so that the surface of the resist layer 3 includes acid. The chemical amplification positive type resist layer 3 treated with acid is baked and then developed to form a resist pattern 7.

REFERENCES:
patent: 4981770 (1991-01-01), Taylor
patent: 5240812 (1993-08-01), Conley
patent: 5258266 (1993-11-01), Tokui
patent: 5326675 (1994-07-01), Niki
"Sensitive Electron Beam Resist Systems Based on Acid-Catalyzed Deprotection", by Iliroshi Ito, SPIE vol. 1086 Advances in Resist Technology and Processing VI, 1989, pp. 11-21.

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