Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-05-11
1994-04-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156646, 156653, 156657, 1566591, 156662, 257750, 437192, 437203, H01L 21306, B44C 122, C23F 100, C03C 1500
Patent
active
RE0345830
ABSTRACT:
A method of the kind consisting in that a contact is obtained with an active zone (11) carried by a semiconductor substrate (10) by means of conductive contact studs (18a) located in the contact openings (16c) of an isolating layer (12) and in that then a metallic configuration of interconnections (22) is formed establishing the conductive connection with the conductive contact studs (18a). A separation layer (13) is provided between the isolating layer (12) and the conductive layer (18), which can be eliminated selectively with respect to the islating layer (12). Thus, the isolating layer (12) retains its original flatness and the conductive contact studs (18a) have an upper level (20) exceeding slightly the level (21) of the isolating layer (12), thus favoring the contact between these contact studs (18a) and the metallic configuration of interconnections (22). Application in microcircuits having a high integration density.
REFERENCES:
patent: 4184909 (1980-01-01), Chang et al.
patent: 4361599 (1982-11-01), Wourms
patent: 4484978 (1984-11-01), Keyser
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patent: 4624864 (1986-11-01), Hartmann
patent: 4640738 (1987-02-01), Fredericks et al.
patent: 4981550 (1991-01-01), Huttemann et al.
Doan Trung T.
Grief Malcolm K.
van Houtum Hendrikus J. W.
van Laarhoven Josephus M. F. G.
Powell William A.
Spain Norman N.
U.S. Philips Corporation
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