Method of fabrication of a die oxide ring

Details Method of fabrication of a die oxide ring Method of fabrication of a die oxide ring

2007-10-02

2007-10-02

Andujar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S700000

Reexamination Certificate

active

10734423

ABSTRACT:
In accordance with the objectives of the invention a new design and method for the implementation thereof is provided in the form of an “oxide ring”. A conventional die is provided with a guard ring or sealing ring, which surrounds and isolates the active surface area of an individual semiconductor die. The “oxide ring” of the invention surrounds the guard ring or sealing ring and forms in this manner a mechanical stress release buffer between the sawing paths of the die and the active surface area of the singulated individual semiconductor die.

REFERENCES:
patent: 5776826 (1998-07-01), Mitwalsky et al.
patent: 6107161 (2000-08-01), Kitaguro et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6448113 (2002-09-01), Lee et al.
patent: 6509622 (2003-01-01), Ma et al.
patent: 6596562 (2003-07-01), Maiz
patent: 6992392 (2006-01-01), Mori

Affiliated with

Also associated with

Rating

Method of fabrication of a die oxide ring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabrication of a die oxide ring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabrication of a die oxide ring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3858301