Etching a substrate: processes – Nongaseous phase etching of substrate – Irradiating – ion implanting – alloying – diffusing – or...
Reexamination Certificate
2006-04-25
2006-04-25
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
Irradiating, ion implanting, alloying, diffusing, or...
C216S002000, C216S024000, C216S097000, C216S108000, C216S109000, C219S121690
Reexamination Certificate
active
07033519
ABSTRACT:
A sub-micron structure is fabricated in a transparent dielectric material by focusing femtosecond laser pulses into the dielectric to create a highly tapered modified zone with modified etch properties. The dielectric material is then selectively etched into the modified zone from the direction of the narrow end of the tapered zone so that as the selective etching proceeds longitudinally into the modified zone, the progressively increasing width of the modified zone compensates for lateral etching occurring closer to the narrow end so as to produce steep-walled holes. The unetched portion of the modified zone produced by translating the laser beam close to and parallel to the bottom surface of the dielectric can serve as an optical waveguide to collect light from or deliver light to the etched channel which can contain various biological, optical, or chemical materials for sensing applications.
REFERENCES:
patent: 6268586 (2001-07-01), Stuart et al.
patent: 6433305 (2002-08-01), Liu et al.
patent: 6573026 (2003-06-01), Aitken et al.
patent: 6754429 (2004-06-01), Borrelli et al.
patent: 6772514 (2004-08-01), Ogura et al.
patent: 2002/0076655 (2002-06-01), Borrelli et al.
patent: 2003/0099264 (2003-05-01), Dantus et al.
patent: WO 02/16070 (2002-02-01), None
Wolf, Silicon Processing for the VLSI Era, 2002, Lattice Press, vol. 4, pp. 672-673.
Wolf et al., Silicon Processing for the VLSI Era, 1986, Lattice Press, vol. 1, pp. 532-533.
“Three-dimensional hole drilling of silica glass from the rear surface with femtosecond laser pulses”, Yan Li, OPTICS LETTERS, vol. 26, No. 23, 2001, pp. 1912-1914.
“Femtosecond laser-assisted three-dimensional microfabrication in silica”, Andrius Marcinkevicius et al., OPTICS LETTERS, vol. 26, No. 5, 2001, pp. 277-279.
“Improved all-optical switching in a three-slab nonlinear directional coupler with gain”, Fabrizio Di Pasquale et al., IEEE, vol. 30, No. 5, 1994, pp. 1254-1248.
“Microfabrication and characteristics of two-dimensional photonic crystal structures in vitreous silica”, Hong-Bo Sun et al., OPTICAL REVIEW, vol. 6, No. 5, 1999, pp. 396-398.
“Three-dimensional microdrilling of glass by multiphoton process and chemical etching”, Yuki Kondo et al., Apply.Phys., vol. 38, 1999, pp. 1146-1148.
Bhardwaj Ravi
Corkum Paul
Hnatovsky Cyril
Rayner David
Taylor Rod
(Marks & Clerk)
Chen Eric B.
Mitchell Richard J.
National Research Council of Canada
Norton Nadine G.
LandOfFree
Method of fabricating sub-micron structures in transparent... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating sub-micron structures in transparent..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating sub-micron structures in transparent... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3529848