Method of fabricating silicon-based MEMS devices

Details Method of fabricating silicon-based MEMS devices Method of fabricating silicon-based MEMS devices

2005-10-21

2008-12-02

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S052000, C438S053000

Reexamination Certificate

active

07459329

ABSTRACT:
A method of fabricating a silicon-based microstructure is disclosed, which involves depositing electrically conductive amorphous silicon doped with first and second dopants to produce a structure having a residual mechanical stress of less than +/=100 Mpa. The dopants can either be deposited in successive layers to produce a laminated structure with a residual mechanical stress of less than +/=100Mpa or simultaneously to produce a laminated structure having a mechanical stress of less than +/=100Mpa.

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