Method of fabricating semiconductor having through hole

Details Method of fabricating semiconductor having through hole Method of fabricating semiconductor having through hole

1998-07-28

1999-09-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438123, 438124, H01L 2144

Patent

active

059535920

ABSTRACT:
The semiconductor device includes a semiconductor chip, a tape for mounting the semiconductor chip thereto, an adhesive resin layer interposed between the semiconductor chip and the tape, and solder balls attached to the tape. The method of fabricating the semiconductor chip comprises the step of forming at least one hole in the tape, after fixing the semiconductor chip to the tape through the adhesive resin layer. Also, the TAB tape is made of polyimide having high water permeability.

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patent: 5063171 (1991-11-01), Geller et al.
patent: 5490324 (1996-02-01), Newman
patent: 5731231 (1998-03-01), Miyajima
patent: 5753535 (1998-05-01), Ebihara
patent: 5756379 (1998-05-01), Haghiri-Tehrani
patent: 5756380 (1998-05-01), Berg et al.
patent: 5834336 (1998-10-01), Maheshwari et al.
patent: 5874784 (1999-02-01), Aoki et al.

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