4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Koji Honna

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Method of fabricating semiconductor having through hole

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Method of fabricating semiconductor having through hole

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Resin molded semiconductor device and method of manufacturing se

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Profile ID: LFUS-PAI-P-1161219

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