Method of fabricating semiconductor devices with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C977S848000

Reexamination Certificate

active

07101761

ABSTRACT:
A method is described for providing a nanostructure suspended above a substrate surface. The method includes providing a nanostructure encased in an oxide shell on a substrate and depositing a sacrificial material and a support material over the oxide encased nanostructure. Then, the sacrificial material is removed to expose the oxide encased nanostructure. Once the oxide encased nanostructure has been exposed, the oxide shell is removed from the oxide encased nanostructure such that the nanostructure is suspended above the substrate surface.

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Gordon, R.G.; Hausmann, D.; Kim, E.; Shepard, J., “A Kinetic Model for Step Coverage by Atomic Layer Deposition in Narrow Holes or Trenches,” Chem. Vap. Deposition, 9, No. 2, 2003, pp. 73-78.

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