Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2005-11-17
2008-08-26
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S794000
Reexamination Certificate
active
07416997
ABSTRACT:
A method of fabricating a semiconductor device having a silicon nitride layer substantially free of impurities includes forming a silicon nitride layer on a semiconductor substrate and annealing the semiconductor substrate having the silicon nitride layer in an atmosphere of ammonia (NH3) gas to remove impurities from the silicon nitride layer. The silicon nitride layer may be formed using BTBAS as a silicon precursor.
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patent: 2001-0050379 (2001-06-01), None
Kim Jae-Hwan
Kim Kyong-Min
Kim Sang-Woon
Park Sang-Kyu
F. Chau & Associates LLC
Picardat Kevin M
Samsung Electronics Co,. Ltd.
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