Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Patent
1998-08-26
2000-11-28
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
438234, H01L 214763
Patent
active
061535028
ABSTRACT:
A method is provided for fabricating an analog and a digital semiconductor device close to each other on a surface of a semiconductor substrate. The analog device is formed on an insulating layer, and in a step configuration with respect to the insulating layer on the side of the digital device. Some deposition steps are used for forming both devices. In addition, the method teaches to form a spacer out of insulating material in the concave corner of the step configuration. The spacer prevents unwanted residual matter from remaining in the concave corner after an etching step and insulates the analog device better.
REFERENCES:
patent: 5296400 (1994-03-01), Park et al.
patent: 5472895 (1995-12-01), Park
patent: 5480837 (1996-01-01), Liaw et al.
patent: 5766992 (1998-06-01), Chou et al.
patent: 5780339 (1998-07-01), Liu et al.
patent: 5924011 (1999-07-01), Huang
Blum David S
Bowers Charles
Samsung Electronics Co,. Ltd.
LandOfFree
Method of fabricating semiconductor device having analog propert does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating semiconductor device having analog propert, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating semiconductor device having analog propert will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1725247