Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1996-01-29
1998-06-02
Quach, T. N.
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438486, 438586, 438655, 438683, H01L 21336
Patent
active
057598991
ABSTRACT:
The invention provides a method of fabricating a semiconductor device, including the steps of (a) depositing a titanium film over a silicon substrate, (b) depositing an amorphous silicon film on the titanium film, (c) carrying out first thermal annealing to form a first TiSi.sub.2 film over a resultant, (d) carrying out second thermal annealing to cause a single crystal silicon layer to grow in a region in which a source/drain region is to be formed, (e) successively removing the amorphous silicon film and the first TiSi.sub.2 film, and (f) forming a highly concentrated diffusion layer in the region, the diffusion layer having conductivity opposite to that of the silicon substrate. In accordance with the method, it is possible to form a salicided MOS transistor which includes a source/drain diffusion layer having shallow junction depth, and low-resistive source/drain regions.
REFERENCES:
patent: 5079180 (1992-01-01), Rodder et al.
patent: 5346860 (1994-09-01), Wei
patent: 5387535 (1995-02-01), Wilmemeyer
patent: 5409853 (1995-04-01), Yu
patent: 5443996 (1995-08-01), Lee et al.
"Raised Source/Drain MOSFET with Dual Sidewall Spacers" Mark Rodder; IEEE Electron Device Letters, vol. 12, No. 3; Mar. 1991 pp. 89-91.
Lau, S., "Solid Phase Epitaxy in Silicide-Forming Systems", Thin Solid Films, vol. 47, 1977, pp. 313-322, Sep. 1977.
Lou, Y., et al., "The Process Window of a-Si/Ti Bilayer Metallization . . . ", IEEE Transactions on Electron Devices, vol. 39, No. 8, Aug. 1992, pp. 1835-1843, Aug. 1992.
NEC Corporation
Quach T. N.
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