Method of fabricating Schottky barrier transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

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C438S570000, C257SE21425, C257SE21432

Reexamination Certificate

active

07902011

ABSTRACT:
Provided is a method of fabricating a Schottky barrier transistor. The method includes (a) forming a pair of cavities for forming a source forming portion and a drain forming portion having a predetermined depth and parallel to each other and a channel forming portion having a fin shape between the cavities in a substrate;(b) filling the pair of cavities with a metal; (c) forming a channel, a source, and a drain by patterning the channel forming portion, the source forming portion, and the drain forming portion in a direction perpendicular to a lengthwise direction of the channel forming portion; (d) sequentially forming a gate oxide layer and a gate metal layer that cover the channel, the source, and the drain on the substrate; and (e) forming a gate electrode corresponding to the channel by patterning the gate metal layer, wherein one of the operations (b) through (e) further comprises forming a Schottky barrier by annealing the substrate.

REFERENCES:
patent: 6835611 (2004-12-01), Tsui et al.
patent: 7646046 (2010-01-01), Russ et al.
patent: 2003/0096491 (2003-05-01), Hizawa
patent: 2004/0099966 (2004-05-01), Chau et al.
patent: 2005/0136617 (2005-06-01), Jang
patent: 2005/0139860 (2005-06-01), Snyder et al.
patent: 2008/0081404 (2008-04-01), Barna et al.

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