Method of fabricating resistive probe having self-aligned...

Details Method of fabricating resistive probe having self-aligned... Method of fabricating resistive probe having self-aligned...

2006-08-03

2009-10-20

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S011000, C438S013000, C438S014000, C438S508000

Reexamination Certificate

active

07605014

ABSTRACT:
A method of fabricating a resistive probe having a self-aligned metal shield. The method includes sequentially forming a first insulating layer, a metal shield, and a second insulating layer on a resistive tip of a substrate; etching the second insulating layer to expose the metal shield on a resistive region; etching the exposed metal shield; and etching the first insulating layer to expose the resistive region.

REFERENCES:
patent: 6703258 (2004-03-01), Hopson et al.
patent: 2003/0012930 (2003-01-01), Brousseau, III
patent: 5-339731 (1993-12-01), None
patent: 10-332714 (1998-12-01), None
patent: 11-121961 (1999-04-01), None
patent: 2002-72897 (2002-03-01), None
patent: 2003-34828 (2003-02-01), None
patent: WO 03/096409 (2003-11-01), None

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