Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2011-01-18
2011-01-18
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S285000, C438S479000, C257S204000, C257S288000, C257S347000, C257S616000, C257SE27046, C257SE21632
Reexamination Certificate
active
07871878
ABSTRACT:
A method of manufacturing a semiconductor device that includes a first and second device regions on a substrate. The method includes the steps of forming an insulation layer on the substrate, laminating a first semiconductor layer having a plane orientation different from the surface of the substrate on the insulation layer and exposing the substrate by removing the insulation layer and the first semiconductor layer from the second device region. A second semiconductor layer having the same plane orientation as the substrate and that is made of a strained layer is formed by epitaxial growth on the exposed substrate in the second device region.
REFERENCES:
patent: 6633066 (2003-10-01), Bae et al.
patent: 7253045 (2007-08-01), Wristers et al.
patent: 7348259 (2008-03-01), Cheng et al.
patent: 7538390 (2009-05-01), Wang et al.
patent: 2005/0221550 (2005-10-01), Fitzgerald
patent: 2005/0274978 (2005-12-01), Antoniadis et al.
patent: 59-177957 (1984-10-01), None
patent: 04-372166 (1992-12-01), None
patent: 09-219524 (1997-08-01), None
patent: 2000-286418 (2000-10-01), None
patent: 2001-044425 (2001-02-01), None
patent: 2001-160594 (2001-06-01), None
patent: 2001-338988 (2001-12-01), None
patent: 2002-198533 (2002-07-01), None
patent: 2002-359367 (2002-12-01), None
patent: 2003-017671 (2003-01-01), None
Japanese Patent Office, Office Action issued in Patent Application JP 2004-294562, on Oct. 27, 2009.
Kataoka Toyotaka
Saito Masaki
Wang Junli
Chambliss Alonzo
SNR Denton US LLP
Sony Corporation
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