Method of fabricating non-volatile memory device with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257S315000, C257S317000, C257S318000, C257S322000, C365S185010, C365S185050, C365S185080, C365S185090, C365S185140, C365S185170, C365S185260, C365S185280, C365S185290, C365S185330, C438S201000, C438S202000, C438S257000, C438S258000, C438S259000, C438S261000, C438S262000, C438S263000, C438S264000, C438S265000, C438S266000, C438S267000, C438S271000, C438S290000, C438S291000, C438S292000, C711S103000

Reexamination Certificate

active

07923327

ABSTRACT:
Provided are a non-volatile memory device and a method of fabricating the same. The non-volatile memory device comprises: a control gate region formed by doping a semiconductor substrate with second impurities; an electron injection region formed by doping the semiconductor substrate with first impurities, where a top surface of the electron injection region includes a tip portion at an edge; a floating gate electrode covering at least a portion of the control gate region and the tip portion of the electron injection region; a first tunnel oxide layer interposed between the floating gate electrode and the control gate region; a second tunnel oxide layer interposed between the floating gate electrode and the electron injection region; a trench surrounding the electron injection region in the semiconductor substrate; and a device isolation layer pattern filled in the trench.

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