Method of fabricating microelectromechanical system structures

Details Method of fabricating microelectromechanical system structures Method of fabricating microelectromechanical system structures

2006-12-26

2006-12-26

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S466000, C438S470000, C438S406000

Reexamination Certificate

active

07153759

ABSTRACT:
A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

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