4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Jun Wei

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Anodic bonding process for ceramics

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Large-field unit-magnification projection optical system

Optical: systems and elements – Lens – Multiple component lenses
Reexamination Certificate

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Method of fabricating microelectromechanical system structures

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Method of fabricating microelectromechanical system structures

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Method of fabricating microelectromechanical system structures

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2415235

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