Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-06-15
2008-08-26
Ahmed, Shamim (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S027000, C216S037000, C216S056000, C216S067000, C347S020000, C347S040000, C347S050000
Reexamination Certificate
active
07416675
ABSTRACT:
A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.
REFERENCES:
patent: 4392907 (1983-07-01), Shirato et al.
patent: 5880762 (1999-03-01), Ishinaga et al.
patent: 2005/0206677 (2005-09-01), Silverbrook
patent: 2007/0268327 (2007-11-01), Silverbrook
Choi Hyung
Shim Dong-sik
Yoon Yong-seop
Ahmed Shamim
Angadi Maki
Samsung Electronics Co,. Ltd.
Stanzion & Kim, LLP
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