Method of fabricating gold bumps on IC's and power chips

Details Method of fabricating gold bumps on IC's and power chips Method of fabricating gold bumps on IC's and power chips

1986-04-17

1988-06-14

Jordan, M.

Metal fusion bonding

Process

With shaping

228170, 228 45, B23K 3102

Patent

active

047506660

ABSTRACT:
A method for depositing gold bumps on metallized pads of semiconductor chips uses a commercially available thermocompression or thermosonic gold wire bonder. The method includes the steps of depositing a gold ball with an attached wire on the metallized pad, and removing the wire so that a gold bump remains on the pad.

REFERENCES:
patent: 4099663 (1978-04-01), Brill et al.
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4230925 (1980-10-01), Lascelles
T. S. Liu et al., "A Review of Wafer Bumping for Tape Automated Bonding", Solid State Technology, vol. 23, No. 3, 71-76 (3/80).
R. G. Oswald et al., "Automated Tape Carrier Bonding for Hybrids", Solid State Technology, vol. 21, No. 3, 39-48 (3/78).
L. F. Miller, "A Survey of Chip Joining Techniques", Proc. 1969, Electronic Components Conference, pp. 60-76.

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