Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Patent
1996-10-07
2000-08-15
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
438592, 438655, 438656, 257296, 257384, 257757, 257770, H01L 213205, H01L 2144, H01L 27108, H01L 2348
Patent
active
061036064
ABSTRACT:
On a substrate with a number rows of gates are formed. After a metal silicide layer is formed above the gates, a silicon-rich layer is formed. The silicon-rich layer is either a further metal silicide layer, with a higher silicon concentration or a pure silicon layer.
REFERENCES:
patent: 4128670 (1978-12-01), Gaenssien
patent: 4851295 (1989-07-01), Brors
patent: 4886764 (1989-12-01), Miller et al.
patent: 4910578 (1990-03-01), Okamoto
patent: 5070038 (1991-12-01), Jin
patent: 5431770 (1995-07-01), Lee et al.
patent: 5441914 (1995-08-01), Taft et al.
patent: 5472896 (1995-12-01), Chen et al.
patent: 5500249 (1996-03-01), Telford et al.
patent: 5604157 (1997-02-01), Dai et al.
patent: 5635765 (1997-06-01), Larson
patent: 5643819 (1997-07-01), Tseng
patent: 5700731 (1997-12-01), Lin et al.
patent: 5723893 (1998-03-01), Yu et al.
IBM Tech. Discl. Bull., vol. 28, No. 9, pp. 3968-3969, Feb. 1986.
Adler et al, IBM Tech. Discl. Bull., vol. 26, No. 5, pp. 2309-2310, Oct. 1983.
Campbell et al, IBM Tech. Discl. Bull., vol. 25, No. 4, pp. 1920-1921. Sep. 1982.
Sheng Yi-Chung
Wu Der-Yuan
Huang Jiawei
Nguyen Ha Tran
Niebling John F.
United Microelectronics Corp.
LandOfFree
Method of fabricating a word line does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a word line, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a word line will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2006284