Method of fabricating a trench capacitor of a mixed mode...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S218000, C438S219000, C438S221000, C438S231000, C438S239000, C438S240000, C438S243000, C438S244000, C438S294000, C438S295000, C438S296000, C438S305000, C438S307000, C438S308000, C438S386000, C438S387000, C438S405000, C438S424000, C438S427000, C438S430000, C438S435000, C438S437000, C438S453000

Reexamination Certificate

active

07022565

ABSTRACT:
A method of fabricating a trench capacitor of a mixed mode integrated circuit includes forming shallow trench isolation regions for isolating active/passive devices on a semiconductor substrate. The lower electrode layer of the polysilicon layer, the dielectric layer, and the upper electrode layer are formed in sequence in a plurality of shallow trench isolation regions to form a trench capacitor. The present invention uses a trench capacitor to substitute for the 3-dimensional structure capacitor to overcome the disadvantages of the conventional capacitor, resulting in increasing the surface area of electrode and the capacitance.

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patent: 2003/0036228 (2003-02-01), Jao
patent: 2005/0139887 (2005-06-01), Song

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