Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-11-12
2008-12-16
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S311000, C438S680000, C257SE21170, C257SE21320, C257SE21293, C257SE21304, C257SE21546
Reexamination Certificate
active
07465669
ABSTRACT:
Embodiments of methods for fabricating a silicon nitride stack on a semiconductor substrate are provided herein. In one embodiment, a method for fabricating a silicon nitride stack on a semiconductor substrate includes depositing a base layer including silicon nitride on the substrate using a first set of process conditions that selectively control the stress of the base layer; and depositing an upper layer including silicon nitride using a second set of process conditions that selectively control at least one of an oxidation resistance and a refractive index of the upper layer.
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Iyer R. Suryanarayanan
Lapena Rubi
Maeda Yuji
Tandon Sanjeev
Zhang Kangzhan
Applied Materials Inc.
Mosier IP Law Group
Nhu David
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