Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-01-30
2007-01-30
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C228S180220
Reexamination Certificate
active
11374378
ABSTRACT:
A semiconductor multi-package module has a second package inverted and stacked over a first package, each of the packages having a die attached to a substrate, in which the second package substrate and the first package substrate are interconnected by wire bonding, and in which the first package includes a ball grid array package. Also, a method for making a semiconductor multi-package module, by providing a lower molded ball grid array package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5229960 (1993-07-01), De Givry
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5899705 (1999-05-01), Akram
patent: 5982633 (1999-11-01), Jeansonne
patent: 5994166 (1999-11-01), Akram et al.
patent: 6118176 (2000-09-01), Tao et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6265766 (2001-07-01), Moden
patent: 6407456 (2002-06-01), Ball
patent: 6413798 (2002-07-01), Asada
patent: 6414381 (2002-07-01), Takeda
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6512303 (2003-01-01), Moden
patent: 6545366 (2003-04-01), Michii et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6593648 (2003-07-01), Emoto
patent: 6607937 (2003-08-01), Corisis
patent: 6649448 (2003-11-01), Tomihara
patent: 6667556 (2003-12-01), Moden
patent: 6706557 (2004-03-01), Koopmans
patent: 6716676 (2004-04-01), Chen et al.
patent: 6734539 (2004-05-01), Degani et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6746894 (2004-06-01), Fee et al.
patent: 6747361 (2004-06-01), Ichinose
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6777819 (2004-08-01), Huang
patent: 6787916 (2004-09-01), Halahan
patent: 6794749 (2004-09-01), Akram
patent: 6818980 (2004-11-01), Perdon, Jr.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6835598 (2004-12-01), Baek et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6864566 (2005-03-01), Choi, III
patent: 6882057 (2005-04-01), Hsu
patent: 6900528 (2005-05-01), Mess et al.
patent: 6906415 (2005-06-01), Jiang et al.
patent: 6906416 (2005-06-01), Karnezos
patent: 6933598 (2005-08-01), Karnezos
patent: 6951982 (2005-10-01), Chye et al.
patent: 6972481 (2005-12-01), Karnezos
patent: 7034387 (2006-04-01), Karnezos
patent: 7045887 (2006-05-01), Karnezos
patent: 7049691 (2006-05-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7053477 (2006-05-01), Karnezos et al.
patent: 7057269 (2006-06-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 2003/0113952 (2003-06-01), Sambasivam et al.
patent: 2003/0153134 (2003-08-01), Kawata et al.
patent: 2001223326 (2001-08-01), None
patent: 20010688614 (2001-07-01), None
patent: 2004085348 (2004-10-01), None
Chambliss Alonzo
ChipPAC, Inc
Haynes Beffel & Wolfeld LLP
Kennedy Bill
LandOfFree
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