Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1998-04-06
2000-10-03
Tsai, Jey
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
H01L 218242
Patent
active
061272191
ABSTRACT:
A method for fabricating a semiconductor memory device with a tree-type capacitor having increased area for reliable storage of electrical charges representative of data thereon. The tree-type capacitor includes a storage electrode having a trunk-like conductive layer coupled to at least one branch-like conductive layer, which can be structured in various shapes that allow the branch-like conductive layer to have increased surface area. The branch-like conductive layers are formed by successively depositing at least one insulating layer and at least one conductive layer over the substrate such that the conductive layer makes a series of twists and turns, defining the shape of the branch-like conductive layer. The surface of the built-up wafer is removed until the conductive layer is divided into a number of segments. A contact hole is formed through the conductive layer to a drain/source region of a transistor in the device, and is filled with a conductive layer, forming the trunk-like layer. The insulating material is wet-etched away, leaving the conductive segment attached to the truck-like layer as a branch-like conductive layer. A dielectric layer is formed over exposed surfaces of the trunk-like conductive layer and the branch-like conductive layer, and a further conductive layer is formed overlaying the dielectric layer to serve as an opposing electrode of the tree-type capacitor.
REFERENCES:
patent: 5071783 (1991-12-01), Taguchi et al.
patent: 5077688 (1991-12-01), Kumanoya et al.
patent: 5089869 (1992-02-01), Matsuo et al.
patent: 5102820 (1992-04-01), Chiba
patent: 5126810 (1992-06-01), Gotou
patent: 5142639 (1992-08-01), Kohyama et al.
patent: 5155657 (1992-10-01), Oehrlein et al.
patent: 5158905 (1992-10-01), Ahn
patent: 5164337 (1992-11-01), Ogawa et al.
patent: 5172201 (1992-12-01), Suizu
patent: 5196365 (1993-03-01), Gotou
patent: 5206787 (1993-04-01), Fujioka
patent: 5266512 (1993-11-01), Kirsch
patent: 5274258 (1993-12-01), Ahn
patent: 5338955 (1994-08-01), Tamura et al.
patent: 5354704 (1994-10-01), Yang et al.
patent: 5371701 (1994-12-01), Lee et al.
patent: 5389568 (1995-02-01), Yun
patent: 5399518 (1995-03-01), Sim et al.
patent: 5438011 (1995-08-01), Blalock et al.
patent: 5443993 (1995-08-01), Park et al.
patent: 5453633 (1995-09-01), Yun
patent: 5460996 (1995-10-01), Ryou
patent: 5478768 (1995-12-01), Iwasa
patent: 5478770 (1995-12-01), Kim
patent: 5482886 (1996-01-01), Park et al.
patent: 5508222 (1996-04-01), Sakao
patent: 5521419 (1996-05-01), Wakamiya et al.
patent: 5523542 (1996-06-01), Chen et al.
patent: 5543346 (1996-08-01), Keum et al.
patent: 5550080 (1996-08-01), Kim
patent: 5561309 (1996-10-01), Cho et al.
patent: 5561310 (1996-10-01), Woo et al.
patent: 5572053 (1996-11-01), Ema
patent: 5595931 (1997-01-01), Kim
patent: 5863821 (1999-01-01), Chao
"Mini-Trenches in Polysilicon For Dram Storage Capacitance Enhancement", IBM Technical Disclosure Bulletin, vol. 33, No. 9, Feb. 1991.
Ema et al., "3-Dimensional Stacked Capacitor Cell for 16M and 64M DRAMS", International Electron Devices Meeting, pp. 592-595, Dec. 1988.
Wakamiya et al., "Novel Stacked Capacitor Cell for 64-Mb Dram", 1989 Symposium on VLSI Technology Digest of Technical papers, pp. 69-70.
Tsai Jey
United Microelectronics Corp.
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