Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2008-12-16
2009-12-08
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S643000, C438S660000, C257S751000, C257S758000, C257S774000, C257SE21584
Reexamination Certificate
active
07629239
ABSTRACT:
A semiconductor device and a method of fabricating the same are disclosed. The semiconductor device includes a lower wire, an interlayer insulating film formed on the lower wire and having a via hole exposing the upper surface of the lower wire, a diffusion barrier formed on the inner wall of the via hole, and an upper wire filling the via hole and directly contacting the lower wire, in which a dopant region containing a component of the diffusion barrier is formed in the lower wire in the extension direction of the via hole.
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Kim Soon-ho
Maeng Dong-cho
Oh Jun-hwan
Chambliss Alonzo
Mills & Onello, LLP.
Samsung Electronics Co,. Ltd.
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