Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2005-05-23
2009-12-22
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C257SE21625
Reexamination Certificate
active
07635653
ABSTRACT:
A semiconductor integrated circuit that includes thereon a flash memory and a plurality of MOS transistors using different power supply voltages is formed by a process in which a thermal oxidation process is applied to one of the device regions while covering the other device regions by an oxidation-resistant film.
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Kamgar, A., et al., “Impact of nitrogen implant prior to the gate oxide growth on transient enhanced diffusion”, Dec. 7-10, 1997, IEDM 1997, p. 695-8.
Hashimoto Hiroshi
Takahashi Koji
Fujitsu Microelectronics Limited
Kratz Quintos & Hanson, LLP
Weiss Howard
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