Method of fabricating a random access memory cell

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438248, 438391, H01L 218242

Patent

active

061001317

ABSTRACT:
A random access memory cell having a trench capacitor formed below the surface of the substrate. A shallow trench isolation is provided to isolate the memory cell from other memory cells of a memory array. The shallow trench isolation includes a top surface raised above the substrate to reduce oxidation stress.

REFERENCES:
patent: 5389559 (1995-02-01), Hsieh et al.
patent: 5395786 (1995-03-01), Hsu et al.
patent: 5451809 (1995-09-01), Shiozawa et al.
patent: 5512767 (1996-04-01), Noble, Jr.
patent: 5521115 (1996-05-01), Park et al.
patent: 5627092 (1997-05-01), Alsmeier et al.
patent: 5719080 (1998-02-01), Kenney
patent: 5759907 (1998-06-01), Assaderaghi et al.
patent: 5844266 (1998-12-01), Stengl et al.
patent: 5874345 (1999-02-01), Coronel et al.

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