Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2005-02-22
2005-02-22
Chen, Jack (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S417000, C264S272170, C438S051000, C438S127000
Reexamination Certificate
active
06858910
ABSTRACT:
A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective plastic film, which also protects the surfaces of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate.It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
REFERENCES:
patent: 5061049 (1991-10-01), Hornbeck
patent: 5096279 (1992-03-01), Hornbeck et al.
patent: 5151276 (1992-09-01), Sato et al.
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5331454 (1994-07-01), Hornbeck
patent: 5650915 (1997-07-01), Alfaro et al.
patent: 5729050 (1998-03-01), Kim
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5917235 (1999-06-01), Imura
patent: 5936758 (1999-08-01), Fisher et al.
patent: 5939778 (1999-08-01), Boutin et al.
patent: 5939785 (1999-08-01), Klonis et al.
patent: 6534340 (2003-03-01), Karpman et al.
Bednarz George A.
Coyle Anthony L.
Berezny Nema
Brady III Wade James
Chen Jack
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