4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Physical stress responsive

Anthony L. Coyle

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Contact structure for reliable metallic interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate

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Flip chip semiconductor device in a molded chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Flip chip semiconductor device in a molded chip scale...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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High current semiconductor device system having low...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Integrated circuit chip packaging assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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