Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Patent
1998-05-20
2000-06-27
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
438301, 438688, H01L 213205, H01L 214763
Patent
active
06080646&
ABSTRACT:
A method of fabricating a MOS transistor having an aluminum gate is disclosed. On a MOS transistor having a polysilicon gate, an insulating layer is first formed. The device surface is then polished by CMP to expose the polysilicon gate. Then, an aluminum layer is formed on the substrate and then processed through annealing at more than 500.degree. C. so that a portion of the aluminum layer substitutes the polysilicon gate to form an aluminum gate. After removing the substituted polysilicon and the non-reacted aluminum, the NMOS transistor with an aluminum gate is completed.
REFERENCES:
patent: 5670432 (1997-09-01), Tsai
patent: 5801088 (1998-09-01), Gardner et al.
patent: 5923999 (1999-07-01), Balasubramanyam et al.
patent: 5981382 (1999-11-01), Konecni et al.
Ghyka Alexander G.
Niebling John F.
United Microelectronics Corp.
LandOfFree
Method of fabricating a metal-oxide-semiconductor transistor wit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a metal-oxide-semiconductor transistor wit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a metal-oxide-semiconductor transistor wit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1784087