Method of electroplating a copper lead frame with copper

Details Method of electroplating a copper lead frame with copper Method of electroplating a copper lead frame with copper

1987-09-16

1989-01-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437246, 437210, 437220, 156666, 206330, 204 44, 427123, H01L 2160, H01L 2348

Patent

active

048001783

ABSTRACT:
The copper tape that is used in the tape assembly of semiconductor devices is provided with a bondable surface by an electroplated layer of copper. The copper tape is passivated in a weak organic acid solution immediately after plating. In the preferred embodiment the copper tape is also cleaned and passivated prior to electroplating. The passivated copper can be thermosonically bonded using gold wires for up to 144 hours after preparation. The elimination of noble metal plating reduces assembly cost and the passivated copper bonds well to the subsequently applied plastic encapsulant.

REFERENCES:
patent: 4714517 (1987-12-01), Malladi et al.

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