Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging
Reexamination Certificate
2006-02-21
2006-02-21
Chea, Thorl (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Electron beam imaging
C430S320000, C430S321000, C430S322000, C219S121120, C219S121190, C219S121200, C250S492220
Reexamination Certificate
active
07001709
ABSTRACT:
A method of drawing a pattern on a base material by scanning a beam, comprising: drawing a pattern including ring-shaped zones on a first pattern-drawn field on a base material by scanning a beam on a first pattern-drawn field; shifting at least one of the beam source and the base material to scan the beam on a second pattern-drawn field located next to the first pattern-drawn field in such a way that a boundary between the first pattern-drawn field and the second pattern-drawn field is positioned at a joint portion between a slope portion and a side wall portion of the ring-shaped zones; and drawing the pattern on the second pattern-drawn field by scanning a beam so that the joint portion between the slope portion and the side wall portion is drawn at the boundary between the first pattern-drawn field and the second pattern-drawn field.
REFERENCES:
patent: 5114513 (1992-05-01), Hosokawa et al.
patent: 2002/0170887 (2002-11-01), Furuta et al.
patent: 08-095231 (1996-04-01), None
Furuta Kazumi
Masuda Osamu
Chea Thorl
Frishauf Holtz Goodman & Chick P.C.
Konica Corporation
LandOfFree
Method of drawing a pattern on a base material by scanning a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of drawing a pattern on a base material by scanning a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of drawing a pattern on a base material by scanning a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3627366