Method of dispensing fluid onto a wafer

Details Method of dispensing fluid onto a wafer Method of dispensing fluid onto a wafer

1993-08-02

1995-07-04

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430326, 118320, G03C 500

Patent

active

054299128

ABSTRACT:
A method for dispensing fluids on a semiconductor wafer wherein a wafer is mounted on a rotatable chunk, a fluid to be dispensed is introduced into a well through an inlet located adjacent the bottom of the well, rotating the chunk and moving a soft inpact dispensing nozzle, that draws bubble-free fluid from the bottom of the well, over the wafer, and dispensing the fluid at a low pressure and a short distance to the wafer surface.

REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4124411 (1978-11-01), Meuleman et al.
patent: 4827867 (1989-05-01), Takei et al.
patent: 4889069 (1989-12-01), Kawakami
patent: 4922277 (1990-05-01), Carlson et al.
patent: 5252137 (1993-10-01), Tateyama et al.

Affiliated with

Also associated with

Rating

Method of dispensing fluid onto a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of dispensing fluid onto a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of dispensing fluid onto a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-759275