Method of detecting the thickness of thin film disks or wafers

Details Method of detecting the thickness of thin film disks or wafers Method of detecting the thickness of thin film disks or wafers

2005-04-19

2005-04-19

Nguyen, Tu T. (Department: 2877)

Optics: measuring and testing

Dimension

Thickness

Reexamination Certificate

active

06882437

ABSTRACT:
The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.

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