Method of depositing low dielectric constant silicon carbide...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S313000, C430S314000, C430S316000, C427S577000, C427S249150, C427S255290

Reexamination Certificate

active

10375793

ABSTRACT:
A method of forming a silicon carbide layer for use in integrated circuits is provided. The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a nitrogen source in the presence of an electric field. The as-deposited silicon carbide layer incorporates nitrogen therein from the nitrogen source.

REFERENCES:
patent: 3960619 (1976-06-01), Seiter
patent: 4262631 (1981-04-01), Kubacki
patent: 4532150 (1985-07-01), Endo et al.
patent: 4634601 (1987-01-01), Hamakawa et al.
patent: 4759947 (1988-07-01), Ishihara et al.
patent: 4783368 (1988-11-01), Yamamoto et al.
patent: 4822697 (1989-04-01), Haluska et al.
patent: 4885220 (1989-12-01), Kuhman et al.
patent: 4894352 (1990-01-01), Lane et al.
patent: 5000819 (1991-03-01), Pedder et al.
patent: 5082695 (1992-01-01), Yamada et al.
patent: 5103285 (1992-04-01), Furumura et al.
patent: 5176790 (1993-01-01), Arleo et al.
patent: 5232871 (1993-08-01), Ho
patent: 5238866 (1993-08-01), Bolz et al.
patent: 5290354 (1994-03-01), Haluska
patent: 5300951 (1994-04-01), Yamazaki
patent: 5314724 (1994-05-01), Tsukune et al.
patent: 5318857 (1994-06-01), Haluska
patent: 5362526 (1994-11-01), Wang et al.
patent: 5409543 (1995-04-01), Panitz et al.
patent: 5423941 (1995-06-01), Komura et al.
patent: 5427621 (1995-06-01), Gupta
patent: 5451263 (1995-09-01), Linn et al.
patent: 5465680 (1995-11-01), Loboda
patent: 5508067 (1996-04-01), Sato et al.
patent: 5525550 (1996-06-01), Kato
patent: 5554570 (1996-09-01), Maeda et al.
patent: 5563102 (1996-10-01), Michael
patent: 5591494 (1997-01-01), Sato et al.
patent: 5591566 (1997-01-01), Ogawa
patent: 5593741 (1997-01-01), Ikeda
patent: 5597566 (1997-01-01), Huls
patent: 5618619 (1997-04-01), Petrmichl et al.
patent: 5627105 (1997-05-01), Delfino et al.
patent: 5660682 (1997-08-01), Zhao et al.
patent: 5679413 (1997-10-01), Petrmichl et al.
patent: 5693565 (1997-12-01), Camilletti et al.
patent: 5711987 (1998-01-01), Bearinger et al.
patent: 5726097 (1998-03-01), Yanagida
patent: 5741626 (1998-04-01), Jain et al.
patent: 5780163 (1998-07-01), Camilletti et al.
patent: 5801098 (1998-09-01), Fiordalice et al.
patent: 5818071 (1998-10-01), Loboda et al.
patent: 5821168 (1998-10-01), Jain
patent: 5926437 (1999-07-01), Forbes et al.
patent: 5926740 (1999-07-01), Forbes et al.
patent: 5953627 (1999-09-01), Carter et al.
patent: 5989998 (1999-11-01), Sugahara et al.
patent: 5998100 (1999-12-01), Azuma et al.
patent: 6041734 (2000-03-01), Raoux et al.
patent: 6046758 (2000-04-01), Brown et al.
patent: 6051321 (2000-04-01), Lee et al.
patent: 6054379 (2000-04-01), Yau et al.
patent: 6060132 (2000-05-01), Lee
patent: 6068884 (2000-05-01), Rose et al.
patent: 6083852 (2000-07-01), Cheung et al.
patent: 6103456 (2000-08-01), Tobben et al.
patent: 6107192 (2000-08-01), Subrahmanyan et al.
patent: 6114259 (2000-09-01), Sukharev et al.
patent: 6140226 (2000-10-01), Grill et al.
patent: 6147009 (2000-11-01), Grill et al.
patent: 6159871 (2000-12-01), Loboda et al.
patent: 6251770 (2001-06-01), Uglow et al.
patent: 6287990 (2001-09-01), Cheung et al.
patent: 6303523 (2001-10-01), Cheung et al.
patent: 6312793 (2001-11-01), Grill et al.
patent: 6316167 (2001-11-01), Angelopoulos et al.
patent: 6340435 (2002-01-01), Bjorkman et al.
patent: 6340628 (2002-01-01), Van Cleemput et al.
patent: 6364954 (2002-04-01), Umotoy et al.
patent: 6372661 (2002-04-01), Lin et al.
patent: 6410437 (2002-06-01), Flanner et al.
patent: 6417092 (2002-07-01), Jain
patent: 6429121 (2002-08-01), Hopper et al.
patent: 6436824 (2002-08-01), Chooi et al.
patent: 6444568 (2002-09-01), Sundararajan et al.
patent: 6462371 (2002-10-01), Weimer et al.
patent: 6465366 (2002-10-01), Nemani et al.
patent: 6489238 (2002-12-01), Tsui
patent: 6495448 (2002-12-01), Lee
patent: 6528423 (2003-03-01), Cataby et al.
patent: 6528426 (2003-03-01), Olsen et al.
patent: 6531398 (2003-03-01), Gaillard et al.
patent: 6534397 (2003-03-01), Okada et al.
patent: 6537733 (2003-03-01), Campana et al.
patent: 6555476 (2003-04-01), Olsen et al.
patent: 6593653 (2003-07-01), Sundararajan et al.
patent: 6627532 (2003-09-01), Gaillard et al.
patent: 6630412 (2003-10-01), Shioya et al.
patent: 6645883 (2003-11-01), Yamamoto et al.
patent: 6756672 (2004-06-01), You et al.
patent: 6764958 (2004-07-01), Nemani et al.
patent: 6777349 (2004-08-01), Fu et al.
patent: 6764311 (2004-09-01), Huang et al.
patent: 6812134 (2004-11-01), Lu et al.
patent: 6855484 (2005-02-01), Campana et al.
patent: 2002/0164872 (2002-11-01), Han et al.
patent: 2002/0182894 (2002-12-01), Andideh
patent: 2003/0020108 (2003-01-01), Weimer et al.
patent: 2003/0045125 (2003-03-01), Bao et al.
patent: 2004/0106278 (2004-06-01), Xu et al.
patent: 0 725 440 (1996-08-01), None
patent: 0 771 886 (1997-07-01), None
patent: 0 926 715 (1999-06-01), None
patent: 0 926 724 (1999-06-01), None
patent: 1 050 601 (2000-11-01), None
patent: 61-257475 (1986-11-01), None
patent: 06-204191 (1994-07-01), None
patent: 10-223758 (1998-08-01), None
patent: WO 99/33102 (1999-07-01), None
patent: WO 00/19498 (2000-04-01), None
patent: WO 00/19508 (2000-04-01), None
Gaillard, et al., “Method of Decreasing the K Value in SIOC Layer Deposited By Chemical Vapor Deposition,” filed Oct. 5, 2000, U.S. Appl. No. 09/679,843.
Nemani, et al., “Dual Frequency Plasma Enhanced Chemical Vapor Deposition of Silicon Carbide Layers,” filed Sep. 12, 2000, U.S. Appl. No. 09/660,268.
U.S. Appl. No. 09/627,667, “Method of Depositing Dielectric Films”, Nemani, et al.
Huang, et al., “Method and Apparatus for Treating Low k Dielectric Layers to Reduce Diffusion,” filed Jul. 10, 2001, U.S. Appl. No. 09/902,518.
Lang, et al., “A Method of Depositing a Low K Dielectric Barrier Film for Copper Damascene Application,” filed Mar. 4, 2002, U.S. Appl. No. 10/092,203.
Dijkstra, et al. “Optimization of Anti-Reflection Layers for Deep UV Lithography”, Proceedings of SPIE Optical/Laser Microlithography VI, vol. 1927 1993, pp. 275-286.
European Search Report from EP 01116054.6-2119 dated Oct. 30, 2001.
Ogawa, et al. “Novel ARC Optimization Methodology for KrF Excimer Laser Lithography at Low K1 Factor”, Proceedings of the SPIE Optical/Laser Microlithography V, vol. 1674 1992, pp. 362-375.
Swope, et al. “Improvement of Adhesion Properties of Fluorinated Silica Glass Films by Nitrous Oxide Plasma Treatement” J. Electrochemical Society 144(7) Jul. 1977, pp. 2259-2564.
Takeishi, et al. Stabilizing Dielectric Constants of Fluorine-Doped SiO2 Films by N2O-Plasma Anealing, J. Electrochemical Society 143(1) Jan. 1996, pp. 381-384.
Girginoudi, et al. “The Effect of Hydrogen on the Optoelectronic Properties of Amorphous Silicon-Carbide Films” J. Appl. Phys. 69 (3) Feb. 1, 1991, pp. 1490-1492.
Goldstein, et al. “Properties of p+ Microcrystalline Films of SiC:H Deposited by ConventionalrfGlow Discharge” Appl. Phys. Lett. 53 (26), Dec. 26, 1988, pp. 2672-2674.
Meikle, et al. “The Role of Hydrogen Dilution in Deposition of α-SiC:H from Silane/Ethylene Mixtures” American Institute of Physics (1990) pp. 1048-1050.
Rynders, et al. “Structure Evolution in α-SiC:H Films Prepared from Tetramethylsilane” J. Appl. Phys. 69 (5), Mar. 1, 1991, pp. 2951-2959.
Tsai “Characterization of Amorphous Semiconducting Silicon-boron Alloys Prepared by Plasma Decomposition,” The American Physical Society, Feb. 15, 1979, vol. 19, No. 4, pp. 2041-2054.
Tsuge, et al. “Improvement in Wide-Cap A-Si:H for High Efficiency Solar Cells,” MRS Spring Meeting, Apr. 27-May 1, 1992, San Francisco (3 pages).
Xu, et al. “Blok-A Low-k Dielectric Barrier/Etch Stop Film for Copper Damascene Applications” IEEE (1999) (3 pages).
Yamazaki, et al. “AC Conductivity of Undoped α-Si:H and μc-Si:H in Connection with Morphology and Optical Degradation” Japanese Journal of Applied Physics, vol. 28, No. 4, Apr. 1989, pp. 577-585.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of depositing low dielectric constant silicon carbide... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of depositing low dielectric constant silicon carbide..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of depositing low dielectric constant silicon carbide... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3734201

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.