Method of de-chucking wafer using direct voltage and...

Details Method of de-chucking wafer using direct voltage and... Method of de-chucking wafer using direct voltage and...

2011-01-11

2011-01-11

Nguyen, Danny (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

C361S230000

Reexamination Certificate

active

07869185

ABSTRACT:
Example embodiments provide a method of de-chucking a wafer by alternating between using a direct voltage and an alternating voltage, and an apparatus for fabricating a semiconductor device using the same. The method of de-chucking a wafer comprises interrupting a chucking voltage applied to an electrostatic chuck, applying a first de-chucking voltage to the electrostatic chuck, and applying a second de-chucking voltage to the electrostatic chuck.

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