Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-03-22
2005-03-22
Chen, Kin-Chan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S702000
Reexamination Certificate
active
06869882
ABSTRACT:
A photonic via is made in a substrate by making a hole in the substrate, depositing a cladding into the hole, and then depositing an optical core material into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
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Chen Kin-Chan
Reif Kevin A.
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