Method of creating a photonic via using deposition

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S702000

Reexamination Certificate

active

06869882

ABSTRACT:
A photonic via is made in a substrate by making a hole in the substrate, depositing a cladding into the hole, and then depositing an optical core material into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.

REFERENCES:
patent: 4879318 (1989-11-01), Lipscomb et al.
patent: 4989934 (1991-02-01), Zavracky et al.
patent: 5169188 (1992-12-01), Kupperman et al.
patent: 5346583 (1994-09-01), Basavanhally
patent: 5400419 (1995-03-01), Heinen
patent: 5416870 (1995-05-01), Chun et al.
patent: 5604835 (1997-02-01), Nakamura et al.
patent: 5659640 (1997-08-01), Joyner
patent: 5721797 (1998-02-01), Basavanhally et al.
patent: 5764832 (1998-06-01), Tabuchi
patent: 5790583 (1998-08-01), Ho
patent: 5878070 (1999-03-01), Ho et al.
patent: 6301401 (2001-10-01), La
patent: 6311004 (2001-10-01), Kenney et al.
patent: 6330377 (2001-12-01), Kosemura

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of creating a photonic via using deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of creating a photonic via using deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of creating a photonic via using deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3401191

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.