4. Fishing, trapping, and vermin destroying

Venkatesan Murali

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Bonding pad structure having an interposed rigid layer

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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Controlled collapse chip connection (C4) integrated circuit...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Dielectric decal for a substrate of an integrated circuit...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Lithographically defined optic array

Optical waveguides – With optical coupler – With alignment device
Reexamination Certificate

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Markings for aligning fiber optic bundle

Optical waveguides – With optical coupler – With alignment device
Reexamination Certificate

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Profile ID: LFUS-PAI-P-473537

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