Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With radio frequency antenna or inductive coil gas...
Reexamination Certificate
2007-12-19
2011-11-22
Alejandro, Luz L. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With radio frequency antenna or inductive coil gas...
C118S7230IR, C118S7230AN
Reexamination Certificate
active
08062472
ABSTRACT:
The present invention generally provides apparatus and method for adjusting plasma density distribution in an inductively coupled plasma chamber. One embodiment of the present invention provides an apparatus configured for processing a substrate. The apparatus comprises a chamber body defining a process volume configured to process the substrate therein, and a coil assembly coupled to the chamber body outside the process volume, wherein the coil assembly comprises a coil mounting plate, a first coil antenna mounted on the coil mounting plate, and a coil adjusting mechanism configured to adjust the alignment of the first coil antenna relative to the process volume.
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Bottini Philip A.
Curtis Roger
Liu Wei
Nguyen Hanh D.
Nguyen Son T.
Alejandro Luz L.
Applied Materials Inc.
Patterson & Sheridan L.L.P.
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