Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-06-13
2006-06-13
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07060613
ABSTRACT:
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.
REFERENCES:
patent: 4685030 (1987-08-01), Reyes et al.
patent: 5441569 (1995-08-01), Veligdan et al.
patent: 5459098 (1995-10-01), Maya
patent: 5767009 (1998-06-01), Yoshida et al.
patent: 5795818 (1998-08-01), Marrs
patent: 5804876 (1998-09-01), Lake et al.
patent: 5891756 (1999-04-01), Erickson
patent: 5904859 (1999-05-01), Degani
patent: 5923955 (1999-07-01), Wong
patent: 6177729 (2001-01-01), Benenati et al.
patent: 6410415 (2002-06-01), Estes et al.
patent: 6552555 (2003-04-01), Nuytkens et al.
patent: 2003/0027083 (2003-02-01), Fuller et al.
patent: 391553 (1990-03-01), None
patent: 428610 (1935-05-01), None
patent: 813819 (1959-05-01), None
patent: 399815 (2004-09-01), None
Lewis, “Hawley's Condensed Chemical Dictionary,” 13th ed., Wiley & Sons, 1997, p. 786.
Aliyu Yakub
Chooi Simon
Gupta Subhash
Ho Paul
Roy Sudipto
Ackerman Stephen B.
Chartered Semiconductor Manufacturing Ltd.
Geyer Scott
Saile Ackerman LLC
Stanton Stephen G.
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