Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-11-22
2005-11-22
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S660000, C438S661000, C438S674000, C438S781000
Reexamination Certificate
active
06967162
ABSTRACT:
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.
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The Merck Index, ninth edtion Merck & Co., Inc., Rahway, NJ, USA, 1976, p. 844, 6318 Nickel Carbenyl.
Aliyu Yakub
Chooi Simon
Gupta Subhash
Ho Paul
Roy Sudipto
Berezny Nema
Chartered Semiconductor Manufacturing Ltd.
Pike Rosemary L. S.
Saile George O.
Stanton Stephen G.
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